International Journal of Abrasive Technology http://www.inderscience.com/browse/index.php?journalID=222&year=2011&vol=4&issue=4 Inderscience Publishers Ltd en-uk International Journal of Abrasive Technology 1752-2641 1752-265X © 2011 Inderscience Publishers Ltd editor@inderscience.com https://www.inderscience.com/images/files/coverImgs/ijat_scoverijat.jpg http://www.inderscience.com/browse/index.php?journalID=222&year=2011&vol=4&issue=4 http://www.inderscience.com/link.php?id=44502 In our previous work, an elliptical ultrasonic assisted grinding (EUAG) method was proposed and the experimental works including the establishment of experimental apparatus and the preliminary experimental results were published earlier in this journal. In this paper, further results on experimental investigations of EUAG of monocrystal sapphire were presented; a series of grinding experiments are carried out to reveal the effects of the process parameters on the surface roughness; by examining the wheel surface conditions and the surface roughness, the influence of wheel wear mode on the surface roughness during the grinding process is also clarified. Experimental investigations of elliptical ultrasonic assisted grinding (EUAG) of monocrystal sapphire
Zhiqiang Liang; Xibin Wang; Yongbo Wu
International Journal of Abrasive Technology, Vol. 4, No. 4 (2011) pp. 279 - 289
In our previous work, an elliptical ultrasonic assisted grinding (EUAG) method was proposed and the experimental works including the establishment of experimental apparatus and the preliminary experimental results were published earlier in this journal. In this paper, further results on experimental investigations of EUAG of monocrystal sapphire were presented; a series of grinding experiments are carried out to reveal the effects of the process parameters on the surface roughness; by examining the wheel surface conditions and the surface roughness, the influence of wheel wear mode on the surface roughness during the grinding process is also clarified.

]]> 10.1504/IJAT.2011.044502 International Journal of Abrasive Technology, Vol. 4, No. 4 (2011) pp. 279 - 289 Zhiqiang Liang; Xibin Wang; Yongbo Wu Key Laboratory of Fundamental Science for Advanced Machining, Beijing Institute of Technology, 5 South Zhongguancun Street, Haidian District, Beijing 100081, China. ' Key Laboratory of Fundamental Science for Advanced Machining, Beijing Institute of Technology, 5 South Zhongguancun Street, Haidian District, Beijing 100081, China. ' Department of Machine Intelligence and Systems Engineering, Akita Prefectural University, 84-4 Tsuchiya-ebinokuchi, Yurihonjo, Akita 015-0055, Japan abrasive technology elliptical ultrasonic assisted grinding EUAG monocrystal sapphire surface roughness wheel wear surface quality process parameters wheel surface grinding wheels. 2011-12-28T23:20:50-05:00 4 4 279 289 2011-12-28T23:20:50-05:00 http://www.inderscience.com/link.php?id=44503 The fracture strength of silicon wafers is crucial in determining the manufacturing yield, operational reliability and device performance of semiconductor components. Many researches have shown the surface finishing and stress release treatments such as wet etching, dry (plasma) etching, polishing, etc., can effectively improve the fracture strength of thinned silicon dies. In this paper, a novel hybrid micromachining method that integrates super-precision grinding process, backside rough finish etching, and backside metal deposition process, is studied with experimental investigation with an aim to improve the fracture strength of thinned silicon dies. The experimental results are shown to enhance the fracture strength by approximately 150% higher than the conventional grinding process with this novel method. In this way the semiconductor manufacturers have the benefits of retaining the mechanical performance as well as electrical or thermal performance of thinned silicon dies with the backside metal processing. Enhancing fracture strength of thinned silicon dies by a hybrid micromachining method
Chuan-Chieh Lin; Hong-Tsu Young; Chao-Wei Tang; Min-Yi Tsai
International Journal of Abrasive Technology, Vol. 4, No. 4 (2011) pp. 290 - 303
The fracture strength of silicon wafers is crucial in determining the manufacturing yield, operational reliability and device performance of semiconductor components. Many researches have shown the surface finishing and stress release treatments such as wet etching, dry (plasma) etching, polishing, etc., can effectively improve the fracture strength of thinned silicon dies. In this paper, a novel hybrid micromachining method that integrates super-precision grinding process, backside rough finish etching, and backside metal deposition process, is studied with experimental investigation with an aim to improve the fracture strength of thinned silicon dies. The experimental results are shown to enhance the fracture strength by approximately 150% higher than the conventional grinding process with this novel method. In this way the semiconductor manufacturers have the benefits of retaining the mechanical performance as well as electrical or thermal performance of thinned silicon dies with the backside metal processing.

]]> 10.1504/IJAT.2011.044503 International Journal of Abrasive Technology, Vol. 4, No. 4 (2011) pp. 290 - 303 Chuan-Chieh Lin; Hong-Tsu Young; Chao-Wei Tang; Min-Yi Tsai National Taiwan University, Room 138, Engineering Building, No. 1, Sec. 4, Roosevelt Rd., Taipei 10617, Taiwan. ' National Taiwan University, Room 138, Engineering Building, No. 1, Sec. 4, Roosevelt Rd., Taipei 10617, Taiwan. ' National Taiwan University, Room 138, Engineering Building, No. 1, Sec. 4, Roosevelt Rd., Taipei 10617, Taiwan. ' Department of Mechanical Engineering, Chang Gung University, No. 259, Wen-Hwa 1st Rd., Kwei-Shan, Tao-Yuan 33302, Taiwan fracture strength thinned silicon dies backside metal processing micromachining silicon wafers manufacturing yield reliability semiconductor components super-precision grinding backside rough finish etching backside metal deposition. 2011-12-28T23:20:50-05:00 4 4 290 303 2011-12-28T23:20:50-05:00 http://www.inderscience.com/link.php?id=44506 This paper deals with the wear behaviour of polycrystalline diamond tool of 0.5 m grain size during micro-grinding of BK7 glass. It was found that tool wear caused both diameter and length reduction and G ratio was found to be 940. Observation of tool surface gave clear indication of edge chipping and abrasion type of tool wear where grain was pulled out and micro-cracks and built up edge mechanism are responsible for wear mode. Tool wear progress can be divided into three stages. In the initial stage, tool suffers insignificant wear, then intermediate wear, and finally, severe worn out tool. Huge pitting on bottom surface, chipped side wall, longer centre line and double side wall lining are the major phenomena of severe tool wear. Moreover, the increasing tendency of normal cutting force is found to support the evidence of tool blunting but cannot clearly indicate the severity of wear. Monitoring of root mean square acoustic emission signal is found to give an indication of tool topographic condition, i.e., sharpness and bluntness of cutting edge. Moreover, this signal can also envisage minor and major tool chipping condition. Hence, monitoring the AE signal can be a plausible way of monitoring PCD tool condition. Characterisation and online monitoring of wear behaviour of on-machine fabricated PCD micro-tool while vertical micro-grinding of BK7 glass
Asma Perveen; Y.S. Wong; M. Rahman
International Journal of Abrasive Technology, Vol. 4, No. 4 (2011) pp. 304 - 324
This paper deals with the wear behaviour of polycrystalline diamond tool of 0.5 m grain size during micro-grinding of BK7 glass. It was found that tool wear caused both diameter and length reduction and G ratio was found to be 940. Observation of tool surface gave clear indication of edge chipping and abrasion type of tool wear where grain was pulled out and micro-cracks and built up edge mechanism are responsible for wear mode. Tool wear progress can be divided into three stages. In the initial stage, tool suffers insignificant wear, then intermediate wear, and finally, severe worn out tool. Huge pitting on bottom surface, chipped side wall, longer centre line and double side wall lining are the major phenomena of severe tool wear. Moreover, the increasing tendency of normal cutting force is found to support the evidence of tool blunting but cannot clearly indicate the severity of wear. Monitoring of root mean square acoustic emission signal is found to give an indication of tool topographic condition, i.e., sharpness and bluntness of cutting edge. Moreover, this signal can also envisage minor and major tool chipping condition. Hence, monitoring the AE signal can be a plausible way of monitoring PCD tool condition.

]]> 10.1504/IJAT.2011.044506 International Journal of Abrasive Technology, Vol. 4, No. 4 (2011) pp. 304 - 324 Asma Perveen; Y.S. Wong; M. Rahman Department of Mechanical Engineering, National University of Singapore, 10 Kent Ridge Crescent, Singapore 119260, Singapore. ' Department of Mechanical Engineering, National University of Singapore, 10 Kent Ridge Crescent, Singapore 119260, Singapore. ' Department of Mechanical Engineering, National University of Singapore, 10 Kent Ridge Crescent, Singapore 119260, Singapore tool wear polycrystalline diamond tooling BK7 glass cutting force AE signals acoustic emission online monitoring wear behaviour PCD microtools vertical microgrinding micromachining condition monitoring tool monitoring. 2011-12-28T23:20:50-05:00 4 4 304 324 2011-12-28T23:20:50-05:00 http://www.inderscience.com/link.php?id=44507 Ultra high speed shafts are used for cryogenic applications. In this research work, an attempt has been made to finish two shafts simultaneously to the same level of finish using MAF. A setup has been developed to accomplish this objective, and employs the principle similar to that of MAF for external cylindrical surfaces. This paper introduces the new concept of central magnetic core in MAF. Two shafts each having an initial surface finish of 0.7 Development and experimental investigation of MAF setup for finishing of ultra high speed shafts
R. Sandeep Nair; Trilok Singh; J. Ramkumar; Sunil Jha
International Journal of Abrasive Technology, Vol. 4, No. 4 (2011) pp. 325 - 345
Ultra high speed shafts are used for cryogenic applications. In this research work, an attempt has been made to finish two shafts simultaneously to the same level of finish using MAF. A setup has been developed to accomplish this objective, and employs the principle similar to that of MAF for external cylindrical surfaces. This paper introduces the new concept of central magnetic core in MAF. Two shafts each having an initial surface finish of 0.7

]]> 10.1504/IJAT.2011.044507 International Journal of Abrasive Technology, Vol. 4, No. 4 (2011) pp. 325 - 345 R. Sandeep Nair; Trilok Singh; J. Ramkumar; Sunil Jha Cryo-Technology Division, Bhabha Atomic Research Centre, Mumbai 400085, India. ' Cryo-Technology Division, Bhabha Atomic Research Centre, Mumbai 400085, India. ' Department of Mechanical Engineering, Indian Institute of Technology, Kanpur 208016, India. ' Department of Mechanical Engineering, Indian Institute of Technology, Delhi 110016, India magnetic abrasive finishing MAF ultra high speed shafts central magnetic core surface finish cryogenic applications silicon carbide SiC abrasive machining time magnetising current rotational speed . 2011-12-28T23:20:50-05:00 4 4 325 345 2011-12-28T23:20:50-05:00 http://www.inderscience.com/link.php?id=44509 This paper presents the development of neural network model and parameter optimisation of electrical discharge diamond cut-off grinding (EDDCG) during machining of cemented carbides for material removal rate (MRR) and average surface roughness (Ra). The experiments were carried out on a self developed electrical discharge diamond cut-off grinding (EDDCG) attachment on conventional EDM machine. The numbers of experiments were selected based on full factorial design of experimental procedure. After experimentation the data set were divided into a training set and testing set for ANN modelling. The ANN back propagation algorithm with four inputs (current, pulse on-time, duty factor, wheel RPM) two outputs (MRR, Ra) and one hidden layer with 15 neurons is proposed to establish the process model. The model after proper training was found to be capable of predicting the response parameters. The predicted results from ANN model are discussed to get the insight of the process. Further, multi-objective optimisation of EDDCG is done using GRA coupled with entropy measurement method. Neural network modelling and multi objective optimisation of electrical discharge diamond cut-off grinding (EDDCG)
Sanjeev Kumar Singh Yadav; Vinod Yadava
International Journal of Abrasive Technology, Vol. 4, No. 4 (2011) pp. 346 - 362
This paper presents the development of neural network model and parameter optimisation of electrical discharge diamond cut-off grinding (EDDCG) during machining of cemented carbides for material removal rate (MRR) and average surface roughness (Ra). The experiments were carried out on a self developed electrical discharge diamond cut-off grinding (EDDCG) attachment on conventional EDM machine. The numbers of experiments were selected based on full factorial design of experimental procedure. After experimentation the data set were divided into a training set and testing set for ANN modelling. The ANN back propagation algorithm with four inputs (current, pulse on-time, duty factor, wheel RPM) two outputs (MRR, Ra) and one hidden layer with 15 neurons is proposed to establish the process model. The model after proper training was found to be capable of predicting the response parameters. The predicted results from ANN model are discussed to get the insight of the process. Further, multi-objective optimisation of EDDCG is done using GRA coupled with entropy measurement method.

]]> 10.1504/IJAT.2011.044509 International Journal of Abrasive Technology, Vol. 4, No. 4 (2011) pp. 346 - 362 Sanjeev Kumar Singh Yadav; Vinod Yadava Mechanical Engineering Department, Motilal Nehru National Institute of Technology, Allahabad (U.P.) 211004, India. ' Mechanical Engineering Department, Motilal Nehru National Institute of Technology, Allahabad (U.P.) 211004, India electrical discharge diamond cut-off grinding EDDCG material removal rate MRR average surface roughness artificial neural networks ANNs grey relational analysis GRA entropy measurement diamond abrasive modelling cemented carbides electro-discharge diamond cut-off grinding design of experiments surface quality. 2011-12-28T23:20:50-05:00 4 4 346 362 2011-12-28T23:20:50-05:00 http://www.inderscience.com/link.php?id=44510 During drilling of carbon/epoxy composites using grind-drilling method, the temperature of cutting area is high for the grinding mechanism of material removal. A low-temperature air cooling method was proposed and implemented. The results show that low-temperature air cooling method can effectively reduce the temperature of cutting area. The maximum temperature of cutting area is 264.9°C when there was no cooling. Using internal air cooling, the maximum temperature of cutting area is 102.6°C, and the blocking of tool surface and central hole is effectively controlled. In order to avoid the damage caused by cooling air when using internal air cooling, the flow of cooling air should be stopped when the tool tip reaches the maximum temperature position. Grind-drilling of carbon/epoxy composites based on air cooling method
Ben Wang; Hang Gao; Ruifeng Zhang; Quan Wen
International Journal of Abrasive Technology, Vol. 4, No. 4 (2011) pp. 363 - 375
During drilling of carbon/epoxy composites using grind-drilling method, the temperature of cutting area is high for the grinding mechanism of material removal. A low-temperature air cooling method was proposed and implemented. The results show that low-temperature air cooling method can effectively reduce the temperature of cutting area. The maximum temperature of cutting area is 264.9°C when there was no cooling. Using internal air cooling, the maximum temperature of cutting area is 102.6°C, and the blocking of tool surface and central hole is effectively controlled. In order to avoid the damage caused by cooling air when using internal air cooling, the flow of cooling air should be stopped when the tool tip reaches the maximum temperature position.

]]> 10.1504/IJAT.2011.044510 International Journal of Abrasive Technology, Vol. 4, No. 4 (2011) pp. 363 - 375 Ben Wang; Hang Gao; Ruifeng Zhang; Quan Wen Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education, Dalian University of Technology, No. 2 Linggong Road, Ganjingzi District, Dalian City, Liaoning Province, 116024, China. ' Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education, Dalian University of Technology, No. 2 Linggong Road, Ganjingzi District, Dalian City, Liaoning Province, 116024, China. ' FAW-VW Automobile Co., Ltd., No. 5 Anqing Road, Changchun, Jilin Province, 130011, China. ' Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education, Dalian University of Technology, No. 2 Linggong Road, Ganjingzi District, Dalian City, Liaoning Province, 116024, China carbon-epoxy composites grind-drilling air cooling cutting heat temperature abrasive technology grinding drilling. 2011-12-28T23:20:50-05:00 4 4 363 375 2011-12-28T23:20:50-05:00