Forthcoming Articles

International Journal of Technology Management

International Journal of Technology Management (IJTM)

Forthcoming articles have been peer-reviewed and accepted for publication but are pending final changes, are not yet published and may not appear here in their final order of publication until they are assigned to issues. Therefore, the content conforms to our standards but the presentation (e.g. typesetting and proof-reading) is not necessarily up to the Inderscience standard. Additionally, titles, authors, abstracts and keywords may change before publication. Articles will not be published until the final proofs are validated by their authors.

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International Journal of Technology Management (One paper in press)

Regular Issues

  • The Influence of Structural and Relational Attributes of Knowledge Networks on Firm Innovation   Order a copy of this article
    by Yiting Fang, Heng Tang, Hailong Ju 
    Abstract: Firms can effectively identify combinatorial knowledge opportunities using knowledge network attributes that can be exploited to drive innovation. However, few studies have considered the effects of the relational attributes of knowledge networks, let alone the integration of relational and structural attributes. To fill this gap, this study examines how the tie strength of knowledge elements influences firm innovation, along with the moderating roles of degree centrality and structural holes. We gathered patent data from 2009 to 2020 in the semiconductor industry and utilized ordinary least squares (OLS) regression methods to test our hypotheses. The empirical results demonstrate a U-shaped association between tie strength and innovation. Additionally, degree centrality weakens the U?shaped effect, whereas structural holes strengthen it. This study deepens the understanding of knowledge network attributes and firm innovation by investigating the interaction between structural and relational attributes.
    Keywords: knowledge search; knowledge element; knowledge network; degree centrality; structural hole; tie strength; firm innovation; patent data; semiconductor industry; U-shaped association.
    DOI: 10.1504/IJTM.2026.10078801
     

 

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