Calls for papers

 

International Journal of Materials and Product Technology
International Journal of Materials and Product Technology

 

Special Issue on: “Micro/Nano Electronics and MEMS/NEMS Packaging”


Guest Editors:
Professor Cemal Basaran, University at Buffalo, State University of New York, USA
Dr. Hua Ye, State University of New York at Albany, USA
Professor Juan Gomez, EAFIT University, Colombia


The electronics industry has experienced a continuously increasing trend towards miniaturisation during the recent years. New and innovative products are placed into the market every day at sizes ranging from a few millimetres to a few microns. This marked tendency has brought new challenges and questions to the engineering and scientific community responsible for the design and development of the product that is finally placed into the market.

Topics and questions previously raised and fully answered in other related fields appear like new paradigms once the involved sizes go below certain characteristic dimensions. Fully validated physical models, experimental techniques, computational methods and design procedures, among others, need to be revisited.

This special issue on micro/nano electronics is intended to be the proper scenario for posting new questions, discussing different points of view and identifying future challenges in all the aspects related to the development of micro/nanoelectronics and MEMS/NEMS packages. We invite the scientific and engineering community to present and discuss their points of views at the highest level through this special issue of IJMPT. We therefore formally extend this call for high quality research papers not previously published elsewhere and regarding all the aspects related to the current state of the art and future trends in micro/nanoelectronics and development of MEMS/NEMS systems.

Subject Coverage
Topics for discussion include but are not limited to:
  • Electronic and photonic packaging
  • Mechanical, quality and reliability issues in micro/nanoelectronics
  • MEMS/NEMS packaging (including process and reliability)
  • Micro/nanoelectronics/optoelectronic packaging
  • Nanoscale phenomenon in micro/nanoelectronics
  • Thermal management for micro/nanoelectronics
  • Integration and packaging of micro/nano/electronic systems
  • Material development and constitutive modelling for MEMS/NEMS packaging
  • Non-standard packaging
  • Innovative experimental techniques for material characterisation at the micron and submicron level
  • Numerical methods for micron and submicron level applications

Notes for Prospective Authors

Submitted papers should not have been previously published nor be currently under consideration for publication elsewhere

All papers are refereed through a peer review process. A guide for authors, sample copies and other relevant information for submitting papers are available on the Author Guidelines page


Important Dates

Papers must be submitted by: 1 October, 2006